Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines A Focus on Reliability
by Michael Pecht
Print on Demand
Ships From New York
Free Shipping within U.S.A
International Shipping?
Check Delivery Estimate and
Shipping Cost
for your country
| Publisher: | John Wiley & Sons |
| Published In: | 1994 |
| ISBN-10: | 0471594466 |
| ISBN-13: | 9780471594468 |
| Binding Type: | Hardback |
| Weight: | 2.07 lbs |
| Pages: | pp. 426 |
is written by Michael Pecht. The publisher of this title is John Wiley & Sons.